Sekisui thin foam is used as tape bases for fixing parts for IT devices and components for construction,
and in a variety of fields including pharmaceutical.
High flexibility, surface smoothness, and oil resistance appropriate for human skin
Enabling thickness control that is suitable for polishing silicon wafers
High flexibility, surface smoothness, and oil resistance appropriate for human skin
Sealing of uneven surfaces with minimum foam breakage when the tape is peeled off
Achieve both excellent shock absorption and waterproofness/dustproofness and minimum foam breakage when the tape is peeled off
Achieve both excellent shock absorption and waterproofness/dustproofness and minimum foam breakage when the tape is peeled off
Sealing of uneven surfaces with minimum foam breakage when the tape is peeled off
Achieve both sealing of uneven surfaces of displays and waterproof/dustproof; also available in heat-resistant grades