Thinner and sturdier:
Thin foam protects mobile devices behind them.

Smart phone, tablet, smart watch… many mobile devices have been around.
A kindergarten curriculum that uses tablets started recently in Japan. Today, people of all ages carry mobile devices for various purposes. Since they are used in different environments, they need to be smaller, lighter, and sturdier.

Sekisui thin foam can be installed inside mobile devices by sticking it to precision electronic components such as displays and cameras to protect them from the impact of dropping and the entry of water and dust, which could occur in every day life, bringing sturdiness to the devices.

Realizing foam for a narrow gap of 0.1 mm or less:
Sekisui’s thinning technology and resin composition technology

With the spread of organic light emitting diodes (OLEDs), as well as conventional liquid crystal displays (LCDs), more smartphones with high-resolution screens and flexible design will be on the market.
However, thin, light-weight, and high-performance smartphones tend to be more fragile.
The leading cause of the breakage of a mobile device is an external impact. The impact transmitted inside can cause internal components to contact the display, resulting in a hardware failure.

With proprietary thinning technology and special resin composition technology (high impact absorption and high flexibility composition), we have developed foam with cushioning and shock absorption for protecting a display with a minimum thickness of 0.08 mm, which can fit into the small space between the display and internal frame or semiconductor chips.

Foldable design changing the future of mobile devices:
Sekisui technology brings foldable mobile devices into reality.

Smartphone manufacturers have been focusing their attention on developing foldable displays in recent years.
For the purpose of supporting this trend in the smartphone market, Sekisui is seeking to achieve foldable materials with durability (compression recovery) while maintaining high levels of shock absorption and flexibility. We are planning to expand their applications beyond mobile devices as protectors and cushioning materials by combining them with other flexible materials.

Sekisui’s thinning technology and resin composition technology are not restricted to providing shock absorption and cushioning, but they can be combined with other features. We design products with various features including flame retardance, heat insulation, and electrical conductivity or electrical insulation according to the requests from customers.