SifreeX-HL
Seeking shock cushioning, electrically insulating, and siloxane free, as well as high thermal conductive performance:
Sekisui is meeting the challenge of developing new-generation thermal conductive materials with new technology.
Features of SifreeX-HL
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Excellent softness and low pressure to CPU
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High thermal conductivity for high performance CPU to release heat efficiently
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Electrical insulation and low outgas to improve reliability
SifreeX-HL Click here to download a leaflet
(Line up, Property)
Applications of SifreeX-HL
- ADAS Camera
- around CPU
- HDD Device
ADAS camera chip thermal conductive pads
TECHNOLOGY
